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| Electronic Pakaging Science and Technology (EPS)
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Date: August 14-16 (Thu-Sat), 2008
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Venue: Town and Country Hotel, San Diego, CA |
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Abstract Due: Extended to April 20, 2008 |
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Final Paper Due: July 1, 2008 |
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TOPICS |
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Topics of particular interest include but not limited
to:
Materials, processes and reliabilities of electronic packages
- Dielectric materials
- Pb-free solders
- Flip chip bumping and metallization
- Thermal interface materials
- Underfill materials
- Surfaces and interfaces
- Reliability testing and modeling
Materials, processes and reliabilities of semiconductors
- Substrate materials (SOI, strained Si, hybrid, SiGe)
- Silicon nanoelectronics
- High k dielectrics and contact metals for FEOL
- Thin film materials and their deposition (CVD, PVD, ALD)
- RIE and CMP processes
- Device characteristics
- Low k dielectrics and processing for BEOL
- FEOL and BEOL integration
- Chip and packaging interaction
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KEY SPEAKERS |
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- Dr. Seyong Oh (Senior VP, Samsung Electronics)
- Dr. David Seeger (Director, IBM Yorktown Research Center)
- Dr. Gaurang Choksy (Manager, Intel)
- Dr. Krishna Darbha (Manager, Xbox Division, Microsoft)
- Dr. Yishao Lai (Manager,ASE)
- Dr. Choonheung Lee (Director, Amkor)
- Dr. Yeong j. Lee (Manager, Motor ola)
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SYMPOSIUM CO-CHAIRS |
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