It is encouraged that most co-chairs and committee members present a talk.

• Dinner with MST speakers and organizers: Aug. 10 (Thurs), 2006
  
  
• Number of verbal presentations: 28-36
  
  
• Net duration of symposium: approximately 12 hr
  
  
• Duration of a talk: 20-30 min depending on the number of talks
  
  
• Topics of particular interest include but not limited to:
  
  (1) Materials, processes and reliabilities of electronic packages
       a. Dielectric materials
       b. Pb-free solders
       c. Flip chip bumping and metallization
       d. Thermal interface materials
       e. Underfill materials
       f. Surfaces and interfaces
       g. Reliability testing and modeling
  
  (2) Materials, processes and reliabilities of semiconductors
       a. Substrate materials (SOI, strained Si, hybrid, SiGe)
       b. Silicon nanoelectronics
       c. High k dielectrics and contact metals for FEOL
       d. Thin film materials and their deposition (CVD, PVD, ALD)
       e. RIE and CMP processes
       f. Device characteristics
       g. Low k dielectrics and processing for BEOL
       h. FEOL and BEOL integration
       i. Chip and packaging interaction
  
  
  
• Contact:
    • Kang-Wook Lee kwlee@us.ibm.com
    • Bongtae Han bthan@eng.umd.edu
    • Dae-Young Jung jungdy@us.ibm.com
    • Kyung W. Paik kwpaik@kaist.ac.kr
    • Young Ho Kim kimyh@hanyang.ac.kr
    • Koeng Su Lim kslim@ee.kaist.ac.kr