Talk: Heterogeneous Integration and HBM (High Bandwidth Memory) in the AI Era

Biography

Woong Sun Lee is the CEO of SK hynix Semiconductor West Lafayette LLC and VP of SK hynix. Renowned for his expertise in semiconductor packaging, Dr. Lee has been at the forefront of developing innovative solutions in flip-chip packaging and underfill technologies, which are critical for advancing high-performance memory products.

Prior to his current leadership role, Dr. Lee made significant contributions within SK hynix’s packaging division. His efforts in automating and optimizing semiconductor packaging processes have played a pivotal role in the mass production of advanced technologies, such as High Bandwidth Memory (HBM). These breakthroughs have helped solidify SK Hynix’s position as a global leader in the semiconductor industry.

Dr. Lee earned his Ph.D. in Materials Engineering from the Korea Advanced Institute of Science and Technology (KAIST), where he specialized in the development of novel materials and processes for microelectronic packaging. His research achievements have been widely recognized, leading to his inclusion in prestigious biographical references like Marquis Who’s Who in the World.

In addition to his industrial contributions, Dr. Lee is an active participant in various professional organizations and technical committees. He frequently shares his insights at international conferences, contributing to the evolution of industry standards and the broader understanding of semiconductor packaging technologies. His ongoing work continues to push the boundaries of innovation in the field.